材料科学
复合材料
偷看
残余应力
热塑性塑料
复合材料层合板
GSM演进的增强数据速率
断裂(地质)
各向同性
压力(语言学)
复合数
热的
石墨
聚合物
哲学
物理
气象学
电信
量子力学
语言学
计算机科学
作者
Moshe M. Domb,J. S. Hansen
标识
DOI:10.1177/002199839803200403
摘要
A numerical model is developed for prediction of the process-induced thermal residual stresses in thermoplastic composite laminates. The model addresses the development of the three-dimensional residual stress state in fracture-critical free-edge regions as well as through-thickness stress variations. The current approach and analysis provide a unique capability for the investigation of the influence of thermal processing and structural parameters on the resulting buildup of residual stresses during manufacturing. Therefore, it can assist in the design and analysis of thermoplastic composites in terms of tailoring of mechanical and strength characteristics. The applied surface cooling rate from the melt has a strong effect on the free-edge stress levels obtained at room temperature, and in particular the interlaminar stresses. Results are shown for the case of typical cross-ply and quasi-isotropic APC-2 (graphite/polyether-ether-ketone) laminates.
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