材料科学
分层(地质)
毛细管作用
制作
纳米技术
薄脆饼
碳纳米管
数码产品
柔性电子器件
聚合物
复合材料
光电子学
电气工程
工程类
病理
古生物学
生物
构造学
医学
替代医学
俯冲
作者
Heng Zhang,Youdi Liu,Changchun Yang,Xiang Li,Youfan Hu,Lian‐Mao Peng
标识
DOI:10.1002/adma.201805408
摘要
Electronic systems on ultrathin polymer films are generally processed with rigid supporting substrates during fabrication, followed by delamination and transfer to the targeted working areas. The challenge associated with an efficient and innocuous delamination operation is one of the major hurdles toward high-performance ultrathin flexible electronics at large scale. Herein, a facile, rapid, damage-free approach is reported for detachment of wafer-scale ultrathin electronic foils from Si wafers by capillary-assisted electrochemical delamination (CAED). Anodic etching and capillary action drive an electrolyte solution to penetrate and split the polymer/Si interface, leading to complete peel-off of the electronic foil with a 100% success rate. The delamination speed can be controlled by the applied voltage and salt concentration, reaching a maximum value of 1.66 mm s-1 at 20 V using 2 m NaCl solution. Such a process incurs neither mechanical damage nor chemical contamination; therefore, the delaminated electronic systems remain intact, as demonstrated by high-performance carbon nanotube (CNT)-based thin-film transistors and integrated circuits constructed on a 5.5 cm × 5.0 cm parylene-based film with 4 µm thickness. Furthermore, the CAED strategy can be applied for prevalent polymer films and confers great flexibility and capability for designing and manufacturing diverse ultrathin electronic systems.
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