Mechanical strength and millimeter-wave transmittance spectrum of stacked sapphire plates bonded by sodium silicate solution

蓝宝石 材料科学 复合材料 极限抗拉强度 透射率 光学 硅酸钠 破损 极高频率 光电子学 物理 激光器
作者
Takayuki Toda,Y. Sakurai,H. Ishino,T. Matsumura,Kunimoto Komatsu,N. Katayama
出处
期刊:Journal of Astronomical Telescopes, Instruments, and Systems [SPIE]
卷期号:8 (01) 被引量:1
标识
DOI:10.1117/1.jatis.8.1.014008
摘要

The polarization modulator unit for the low-frequency telescope in LiteBIRD employs an achromatic half-wave plate (AHWP). It consists of five layers of a-cut sapphire plate, which are stacked based on a Pancharatnam recipe. In this way, the retardance of the AHWP is a half-wave over a bandwidth of 34 to 161 GHz. The diameter of a single sapphire plate is about 500 mm and the thickness is 5 mm. When a large-diameter AHWP is used for a space mission, it is important for the AHWP to survive launch vibration. A preliminary study indicates that the five-layer stacked HWP has a risk of breakage at the launch unless the five layers are glued together and mechanically treated as one disk. We report our investigation using a sodium silicate solution that can bond the sapphire plates. This technique has been previously investigated as a candidate of cryogenic bonding for a mirror material, including sapphire, of the gravitational wave experiments: LIGO, VIRGO, and KAGRA. We experimentally studied the mechanical strength of the bonded interface for two different surface conditions: polished and unpolished. We demonstrated that the tensile and shear strength >20 MPa for samples with a polished surface. This satisfied the requirement of 5.5 MPa derived from the mechanical simulation assuming a launch load of 30 G. We identified that samples glued on a polished surface exhibit higher strength than unpolished ones by a factor of 2 for tensile and 18 for shear strength. We measured the millimeter-wave transmittance between 90 and 140 GHz using sapphire plates with a diameter of 50 mm before and after bonding. We did not find any optical effects caused by the bonded interface within 2% error in transmittance, which originates from the measurement system.
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