环氧树脂
氯
数码产品
材料科学
腐蚀
电子材料
复合材料
纳米技术
化学
冶金
物理化学
作者
Ryo Yoshimura,Wataru Urano,Yuuki Asuma,Ken‐ichiro Ota
标识
DOI:10.23919/icep58572.2023.10129763
摘要
In the field of semiconductor packaging, the chlorine content in epoxy resins must be decreased because it causes corrosion of metals. We tried to decrease the chlorine content by purification or chemical reaction. As a result, we developed ultra-low chlorine epoxy resins with excellent handleability. These resins are recommendable for highly reliable electronics.
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