材料科学
合金
冶金
扩散焊
粘结强度
扩散
铜
复合材料
图层(电子)
胶粘剂
热力学
物理
作者
Yuanyuan Chen,Yuan Huang,Lu Han,Liu Dongguang,Lai-Ma Luo,Chong Li,Chenxi Liu,Zhi Wang
标识
DOI:10.1016/j.jmrt.2021.11.069
摘要
W/CuCrZr alloy composite panels are promising plasma-facing components for use in future nuclear-fusion reactors. However, the intrinsic immiscibility of W and Cu makes joining them difficult. In this study, we developed a vacuum diffusion bonding method that involves sandblasting of the W substrate surface, Cu electroplating and annealing, and subsequent vacuum diffusion bonding to realize W/CuCrZr joints with high bond strength. The morphologies and structures of the W and W/CuCrZr joints were investigated by scanning electron microscopy, X-ray diffraction, and high-resolution transmission electron microscopy. Sandblasting was found to induce the plastic deformation, roughening, and grain refinement of the W substrate surface. During Cu plating on the surface of the sandblasted W (and subsequent annealing), the Cu layer was embedded in micron-scale irregular pits on the sandblasted W surface, creating a tight bond. The shear bond strength (184 MPa) and bonding quality of a W/CuCrZr joint obtained with the sandblasting/Cu interlayer method was superior to those of a W/CuCrZr joint prepared by conventional vacuum diffusion bonding. The structural origins of this superior W/CuCrZr joint were related to a region of W and Cu interdiffusion with a thickness of approximately 30 nm. This improved vacuum diffusion bonding method for W and CuCrZr can facilitate the development of plasma-facing components for future nuclear-fusion devices.
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