材料科学
微波食品加热
光电子学
网络分析仪(电气)
堆栈(抽象数据类型)
谐振器
天线(收音机)
同轴
波导管
共面波导
电介质
印刷电路板
电气工程
计算机科学
电信
工程类
程序设计语言
作者
Weiwei Feng,Jianping Sun,Yu Wu,G. Wang,Ting Li
标识
DOI:10.1088/1361-6501/ae0818
摘要
Abstract This paper presents a novel high-resolution wireless temperature sensor based on microwave backscattering principles. The proposed design features a sandwich substrate-integrated waveguide (SIW) structure that incorporates a complementary split-ring resonator (CSRR) etched on the upper conductive layer of the PCB stack. This sandwich configuration integrates a temperature-sensitive CaTiO₃ dielectric core between two FR4 substrates (εᵣ=4.2), enabling enhanced electromagnetic field confinement and thermal-frequency transduction. The sensor was fabricated using standard PCB processing techniques. For experimental characterization, the fabricated device was placed on a heating plate and interrogated wirelessly through a rectangular waveguide antenna connected to a vector network analyzer (VNA) via a coaxial-to-waveguide converter. The compact sensor (36mm×36mm×3mm) demonstrates stable operation over 25-125°C with 1.6 MHz/°C temperature-to-frequency resolution. Experimental results validate the design's immunity to metallic interference while maintaining quadratic response characteristics (R²= 0.999935) across the operational range. This study demonstrates the feasibility of the sandwich SIW sensor and its broad application prospects for wireless temperature measuring.
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