化学
铜
镀铜
聚合物
化学工程
冶金
有机化学
电镀
材料科学
图层(电子)
工程类
作者
Anni Zheng,Jin Liu,Junyou Yang,Weiqing Li,Zhaoyun Wang,Fang‐Zu Yang,Dongping Zhan,Tian Zhang
摘要
Metallized polymer materials have been widely applied in the fields of communications, electronics and aerospace.Electroless copper plating is one of the important techniques for surface metallization of polymer materials.The pretreatments of polymer surface can directly affect the adhesion and levelness of the electroless copper coating.In this paper, we introduce in detail the kinds, compositions and properties of non-conductive polymer materials, and review the research progresses of the pretreatments for electroless copper plating on the non-conductive polymer materials' surfaces.
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