材料科学
转印
微图形化
光电子学
胶印
墨水池
纳米技术
柔性电子器件
数码产品
薄板电阻
复合材料
电气工程
图层(电子)
工程类
作者
Jong Youn Kim,Inkook Hwang,Minkyoung Kim,Hyeonwoo Jung,Hyejeong Bae,Youngu Lee
标识
DOI:10.1021/acsami.1c21223
摘要
Copper nanowires (CuNWs) possess key characteristics for realizing flexible transparent electronics. High-quality CuNW micropatterns with high resolution and uniform thickness are required to realize integrated transparent electronic devices. However, patterning high-aspect-ratio CuNWs is challenging because of their long length, exceeding the target pattern dimension. This work reports a novel reverse-offset printing technology that enables the sub-10 μm high-resolution micropatterning of CuNW transparent conducting electrodes (TCEs). The CuNW ink for reverse-offset printing was formulated to control viscoelasticity, cohesive force, and adhesion by adjusting the ligands, solvents, surface energy modifiers, and leveling additives. An inexpensive commercial adhesive handroller achieved a simple, fast, and scalable micropatterning of CuNW TCEs. Easy production of high-quality CuNW micropatterns with various curvatures and shapes was possible, regardless of the printing direction. The reverse-offset-printed CuNW micropatterns exhibited a minimum of 7 μm line width and excellent pattern qualities such as fine line spacing, sharp edge definition, and outstanding pattern uniformity. In addition, they exhibited excellent sheet resistance, high optical transparency, outstanding mechanical durability, and long-term stability. Flexible light-emitting diode (LED) circuits, transparent heaters, and organic LEDs (OLEDs) can be fabricated using high-resolution reverse-offset-printed CuNW micropatterns for applications in flexible transparent electronic devices.
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