像素
碲化镉光电
光子计数
探测器
物理
光学
点间距
X射线探测器
噪音(视频)
图像传感器
X射线
光电子学
炸薯条
材料科学
伽马射线
粒子探测器
半导体
图像(数学)
计算机科学
核物理学
电信
人工智能
作者
P. Fischer,M. Kouda,H. Krüger,A. Lindner,G. Sato,Tadayuki Takahashi,Shin Watanabe,N. Wermes
摘要
A 0.5-mm-thick cadmium telluride (CdTe) semiconductor pixel sensor with 1024 pixels has been bump-bonded onto a two-dimensional (2-D) single photon counting pixel read out chip (MPEC 2.1) using a special gold-stud technique. The pixel size is 200 /spl times/ 200 /spl mu/m/sup 2/, the active area is 6.4 /spl times/ 6.4 mm/sup 2/. The successful operation of this high-Z imaging pixel device is demonstrated. Noise and threshold dispersion as well as the imaging performance are reported.
科研通智能强力驱动
Strongly Powered by AbleSci AI