Topology optimization of liquid-cooled microchannel heat sinks: An experimental and numerical study

Electronics cooling is always a critical challenge for its small profile and high heat flux. Various microchannel heat sinks have been proposed in literature to achieve reliable and energy efficient cooling effect. They are mainly different patterned fin shapes originated from researchers’ experience. In this paper, we present the process of designing liquid-cooled microchannel heat sink fin geometries based on a numerical method, topology optimization. The optimization model is developed to find designs that satisfy heat transfer requirement with low pressure drop penalty. It is implemented based on a derived accurate 2D model with minimizing pressure drop as objective and average junction temperature as a constraint. Parameter study for different velocities and junction temperature constraints is performed. The optimized structures are then post processed under geometry constraints and analyzed by 3D CFD simulation. Size optimization is implemented on conventional straight channel heat sinks, which serve as the benchmark cases. Moreover, an experimental test loop is built to validate the 3D simulation of topology optimized heat sinks and straight channel heat sinks. The performance comparison shows that the topology optimized heat sinks could save up to 50.9% pumping power under the same thermal performance requirement. Detailed CFD analysis is then engaged to examine their thermohydraulic characteristics and reveal the reasons for their superior performance.