材料科学
复合材料
硅橡胶
热导率
热稳定性
复合数
硅酮
纳米-
钻石
热阻
热的
化学工程
物理
工程类
气象学
作者
Chaoyu Wang,Junqi Shen,Zhi Hao,Zhu Luo,Zhe Shen,Xiaolong Li,Le Yang,Qin Zhou
出处
期刊:Journal of Polymer Engineering
[De Gruyter]
日期:2022-03-30
卷期号:42 (6): 544-553
被引量:4
标识
DOI:10.1515/polyeng-2021-0301
摘要
Abstract Insulating materials with heat dissipation are urgently required for modern electronic devices and systems. In this study, 4,4-methylene diphenyl diisocyanate was used as the coupling agent, and nano-diamond (ND) particles were grafted onto the surface of carbon fibers (CFs) to prepare CF-ND/silicone rubber (SR) composites. The ND acted as a “bridge” among CFs, which can reduce the interface thermal resistance between CFs because the dot-like ND can increase the interfacial area of CFs, making it easier to form heat-conducting networks between SR. When the content of CF-ND (1:6) was 20%, the thermal conductivity of the SR composite was 0.305 W/(m·K), 69% higher than that of pure SR. The ND between CFs can improve the dynamic mechanical properties by acting as a crack pinhole. In addition, the CF-ND/SR composites also exhibited excellent thermal stability. This work has enormous potential for advanced electronic devices.
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