材料科学
光电子学
异质结
外延
晶体管
电压
复合材料
电气工程
图层(电子)
工程类
作者
Tadayoshi Deguchi,H. Tomita,A. Kamada,Manabu Arai,Kimiyoshi Yamasaki,Takashi Egawa
标识
DOI:10.1587/transele.e95.c.1343
摘要
Current collapse of AlGaN/GaN heterostructure field-effect transistors (HFETs) formed on qualified epitaxial layers on Si substrates was successfully suppressed using graded field-plate (FP) structures. To improve the reproducibility of the FP structure manufacturing process, a simple process for linearly graded SiO2 profile formation was developed. An HFET with a graded FP structure exhibited a significant decrease in an on-resistance increase ratio of 1.16 even after application of a drain bias of 600V.
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