A fully-packaged silicon micromachined piezoresistive accelerometer
作者
Kevin Walsh,H. Thurman Henderson,Gregory N. De Brabander
标识
DOI:10.1109/secon.1992.202430
摘要
The design and development of a second-generation miniature piezoresistive micromachined accelerometer are presented. Bulk micromachining etching techniques were utilized in the fabrication of the single-crystalline silicon device. The sensor is essentially its own package, consisting of three carefully aligned