数码产品
CMOS芯片
数字电子学
集成电路
电子线路
工程类
电子工程
混合信号集成电路
电路设计
电气工程
计算机科学
标识
DOI:10.1016/0026-2692(91)90024-h
摘要
A brief overview of high-temperature integrated circuit technologies is presented. General comparisons of the high-temperature performance and relative merits of several semiconductor materials, technologies, devices and digital and analog circuits are highlighted. Important advances and developments of the last three decades are outlined, which reflect the prominence of MOSFET technologies. Shortcomings of the temperature models in standard IC computer-aided-design (CAD) programs are summarized and a discussion of near-and long-term research and development needs for high-temperature integrated electronics is presented.
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