Progress in conductive adhesives for microelectronic interconnection

Conductive adhesives have become ideal microelectronic interconnection materials replacing Sn/Pb solders because of the advantages of being lead-free, offering finer pitch interconnection capability, excellent flexibility and less processing steps at lower temperature. The composition, classification, conductivity mechanism, advance of conductive adhesives are reviewed here to support ideas for developing new conductive adhesives as microelectronic interconnection materials with excellent properties/cost ratio.