玻璃化转变
热重分析
差示扫描量热法
电介质
材料科学
热稳定性
氟
单体
三氟甲基
高分子化学
聚合物
固化(化学)
介电损耗
氟化物
化学工程
复合材料
有机化学
化学
无机化学
热力学
烷基
物理
光电子学
工程类
冶金
作者
Xiaoyun Ma,Xin Lu,Manlin Yuan,Hao Lin,Xinyi Pan,Shiao‐Wei Kuo,Zhong Xin
摘要
Abstract The rapid development of integrated circuits puts forward higher requirements for low dielectric constant polymers. In this study, two fluorinated benzoxazine monomers, bis‐(3,4‐dihydro‐3‐(4‐fluoro‐3‐(trifluoromethyl)phenyl)‐2H‐1,3‐benzoxazine)isopropane (BA‐ftfa) and bis‐(3,4‐dihydro‐3‐(4‐fluoro‐3‐(trifluoromethyl)phenyl)‐2H‐1,3‐benzoxazine)isoperfluoropropane (BAF‐ftfa), were successfully synthesized. Differential scanning calorimeter (DSC) was used to monitor the thermal curing behaviors of the monomers and their mixtures. Five groups of polybenzoxazine samples with different fluorine content (25% ~ 35%) were obtained by copolymerizing the two monomers with different mass ratios. The effects of fluorine content on dielectric properties were investigated and the results show that PBAF‐ftfa with the highest fluorine content has the lowest dielectric constant of 2.53 at 1 MHz. Furthermore, the results of thermogravimetric analysis (TGA) and dynamic mechanical analysis (DMA) show that all polymers possess excellent thermal stability and exhibit high glass transition temperatures over than 180°C.
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