黑匣子
计算机科学
电磁兼容性
电子工程
工程类
人工智能
作者
Adish,Suraj R. Rao,A. Lakshmi Devi,Joe Sivaswamy,Dipanjan Gope,P Shanthi
标识
DOI:10.1109/emcsipi50001.2023.10241706
摘要
With the development of faster and denser electronic networks in today's automotive industry, EMC Compliance tests have become more stringent. Therefore, it is proving to be difficult to predict and mitigate these System-level emissions. Hence, frontloading is an excellent approach to analyzing and monitoring the EMI/EMC performance from the design stage (Pre-prototype) to the verification stage (post-Prototype), allowing a cost-effective resolution of any upstream issues. A major pain point faced by EMC engineers is the lack of accurate models for Integrated Circuits, currently IBIS models and SPICE simulations are being taken to model the ICs behavior which are not useful at higher frequency ranges. Therefore, the motivation of this work is to develop a DC-DC Boost converter IC model using the Nonlinear IC-Emission Modelling method and to analyze different EMI mitigation methods to reduce the PCB emissions during the design phase. The proposed model is implemented on the DUT with the Boost converter IC fabricated on the PCB. The System-level-simulation using the ICEM model is validated with measurement.
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