锑化铟
材料科学
位错
薄脆饼
锑化镓
Crystal(编程语言)
铟
腐蚀坑密度
单晶
蚀刻(微加工)
结晶学
结晶
凝聚态物理
光电子学
复合材料
化学
有机化学
图层(电子)
计算机科学
程序设计语言
超晶格
物理
作者
N. Yu. Komarovsky,E. V. Molodtsova,A. G. Belov,M. B. Grishechkin,R. Yu. Kozlov,S. S. Kormilitsina,E. O. Zhuravlev,M. S. Nestyurkin
出处
期刊:Заводская лаборатория. Диагностика материалов
[TEST-ZL Publishing]
日期:2023-08-24
卷期号:89 (8): 38-46
被引量:6
标识
DOI:10.26896/1028-6861-2023-89-8-38-46
摘要
Single-crystal indium antimonide InSb is an indispensable material in such branches of solid-state electronics as opto- and nanoelectronics. In turn, the dislocation density and the character of their distribution, which directly depend on the technological parameters of the growth process, considerably determine the physical and mechanical properties of the material. We present the results of studying InSb single crystals obtained by the modernized Czochralski method in the crystallographic directions [100], [111], and [112]. The effect of growth conditions (axial and radial temperature gradients at the crystallization front) on the dislocation structure of InSb plates and the structural properties of the plates were analyzed. Using the method of selective etching it was shown that the number of etching pits on the wafers with different orientations differs by approximately an order of magnitude (10 3 cm – 2 for plane (111) and 10 2 cm – 2 for (100)). Number of etch pits for the (100) plane is commensurate with their number in crystals grown in the [112] and [100] directions. Probably, the maximum dislocation density in InSb single crystals can be considered as a material constant, and the increased strength of single crystals grown at lower axial gradients at the crystallization front is related to the formation of a characteristic ensemble of point defects along the dislocation line through diffusion. It is shown that InSb wafers [112] (100) exhibit the best physical and mechanical properties. The results obtained can be used in the manufacture of structures for photodetectors, in particular, in plate processing (cutting, grinding and polishing) to optimize technological processes.
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