纳米技术
计算机科学
半导体
管道(软件)
系统工程
数据科学
材料科学
人工智能
工程物理
工程类
光电子学
程序设计语言
作者
Yanping Zheng,Hao Xu,Zhexin Li,Linlin Li,Yongchao Yu,Pengfei Jiang,Yanmeng Shi,Jing Zhang,Yuqing Huang,Qing Luo,Zheng Lou,Lili Wang
标识
DOI:10.1002/adma.202504378
摘要
Abstract To address the persistent challenges of scaling and power consumption in integrated circuits and chips, recent research has focused on exploring novel semiconductor materials beyond silicon and designing new device architectures. The vastness of the material and parameter space poses significant challenges in terms of cost and efficiency for traditional experimental and computational methods. The rise of artificial intelligence (AI) offers a highly promising avenue for accelerating semiconductor technology development. AI‐driven methods demonstrate significant advantages in analyzing and interpreting large datasets, potentially freeing researchers to focus on more creative endeavors. This review provides a detailed and timely overview of how AI‐driven approaches are assisting researchers across the entire semiconductor research pipeline, encompassing materials discovery, semiconductor screening, synthesis, characterization, and device performance optimization, highlighting how their integration facilitates a holistic understanding of the entire processing‐structure‐property‐performance (PSPP) relationship. Remain challenges related to dataset quality, model generalizability, and autonomous experimentation, as well as the under‐application of AI to critical needs are discussed in the semiconductor field, such as wafer‐scale growth of high‐quality, single‐crystal semiconductor thin films beyond silicon. Addressing these challenges requires collaborative efforts from researchers across various organizations and disciplines, and represents a key focus for future research.
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