Semiconductor Wafer Loss and Efficiency Improvement Using the Contradiction of TRIZ

特里兹 薄脆饼 矛盾 半导体 材料科学 制造工程 工程类 工程物理 可靠性工程 光电子学 哲学 认识论
作者
Hong Kyun Shim,Yong Won Song,Joun Seon Noh
出处
期刊:Asia-Pacific journal of convergent research interchange [Future Convergence Technology Research Society]
卷期号:7 (11): 1-14
标识
DOI:10.47116/apjcri.2021.11.01
摘要

With the growth of artificial intelligence and Big Data-related industries, the semiconductor industry, which is an essential element, continues to develop.Currently, semiconductors are being developed using nanometa-scale wire widths tens of thousands of times thinner than hair, and they are being applied to production equipment for mass production.This paper addresses the problem arising from the Ashing process, which eliminates photoresist and helps form linewidth of semiconductor internal circuits, among numerous processes that form circuits on wafers during the semiconductor manufacturing process.In the process of proceeding with the etching process, a wafer slides occurs inside a pressure conversion space called an air lock.Due to this problem, wafer loss occurs, and the operation of the device is stopped due to the stop of the production equipment, resulting in a problem of decreasing efficiency.Due to this problem, wafer loss occurs, and the operation of the device is stopped due to the stop of the production equipment, resulting in a problem of decreasing efficiency.Semiconductor production also decreases due to the decrease in efficiency of production equipment.Only by reducing chip losses and maximizing efficiency can limited equipment and maximum production without loss within a certain period of time can companies benefit.Semiconductor production is also reduced due to reduced efficiency of production equipment.Only when wafer loss is reduced and efficiency is maximized can limited equipment and maximum production without loss in a given time, which is linked to corporate profits.This paper is aimed to solve the problem of reducing chip loss and decreasing efficiency by improving the instantaneous maintenance (BM) of the device, which is one of the reasons for the decrease in efficiency of the device.Although two characteristics that contradict one physical property are required, the exact problem is solved by analyzing the cause and effect of TRIZ's problem solving method and chain analysis, and the contradiction problem is solved by using 40 inventive principles.

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