材料科学
夹紧
铁电性
四方晶系
光电子学
小型化
薄膜
压电
基质(水族馆)
磁畴壁(磁性)
透射电子显微镜
铁弹性
扫描电子显微镜
纳米技术
复合材料
工作(物理)
凝聚态物理
平版印刷术
谐波传动
极化
热电性
减刑
作者
Zishen Tian,Menglin Zhu,Jaegyu Kim,Piush Behera,Michael Xu,Thomas Lee,Ching‐Che Lin,Sreekeerthi Pamula,Archana Raja,Hao Pan,Jieun Kim,James M. LeBeau,Lane W. Martin
标识
DOI:10.1002/adma.202518417
摘要
ABSTRACT There is considerable interest in thin‐film electromechanical materials due to the prospect for device miniaturization for an array of applications. The electromechanical response of thin films, however, is generally limited by substrate clamping and electrical breakdown. This work designs thin‐film piezoceramics with sub‐100‐nm thickness that address the limitations of clamping and breakdown strength and, as a result, produces films that rival or surpass their bulk piezoceramics counterparts in terms of performance. In the tetragonal ferroelectric PbZr 0.2 Ti 0.8 O 3 , strain‐induced mixtures of in‐ and out‐of‐plane oriented domain structures are leveraged to achieve the ferroelastic interconversion of in‐plane‐polarized a domains to out‐of‐plane‐polarized c domains, opening a pathway to enhanced electromechanical response (1.25%, = 170 pm/V). Operando second harmonic generation and scanning transmission electron microscopy studies confirm the a ‐to‐ c ferroelastic conversion, and establish the switching from a 1 / a 2 to c / a superdomains as the underlying mechanism for the large response. In turn, PbZr 0.2 Ti 0.8 O 3 /0.68PbMg 1/3 Nb 2/3 O 3 ‐0.32PbTiO 3 /PbZr 0.2 Ti 0.8 O 3 trilayers are fabricated to improve the electrical‐breakdown strength while maintaining the domain‐structure interconversion, resulting in the enhancement of the electromechanical strain to 2.1%. Overall, by combining domain‐structure optimization and multilayer‐heterostructure design, remarkable electromechanical response can be achieved even in sub‐100‐nm thin films normally subject to clamping effects.
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