Application Study of Epoxy Prepreg for Thermally Conductive Materials

ABSTRACT Alumina/epoxy composites are widely used and extensively studied owing to their excellent performance and cost‐effectiveness. However, most research has focused on the primary curing system of epoxy resin, with little consideration given to the latent curing system of epoxy resin. In this work, dicyandiamide was used as a latent curing agent, alumina as the thermal conductive filler, and a flexible epoxy resin as the base material to prepare a thermally conductive epoxy prepreg. This material exhibits good thermal conductivity, excellent bonding with copper and aluminum metal films, and possesses strong temperature resistance and weatherability. It shows promising potential for large‐scale applications.