材料科学
单晶硅
薄脆饼
半导体
光电子学
外延
太阳能电池
光伏
晶界
量子点太阳电池
多晶硅
薄膜
等离子太阳电池
基质(水族馆)
硅
聚合物太阳能电池
纳米技术
光伏系统
冶金
电气工程
微观结构
工程类
薄膜晶体管
地质学
海洋学
图层(电子)
出处
期刊:IGI Global eBooks
[IGI Global]
日期:2013-02-14
卷期号:: 254-293
被引量:1
标识
DOI:10.4018/978-1-4666-1996-8.ch010
摘要
The prospects for cost-effective flat plate (non-concentrator) solar cells based on III-V compound semiconductors (e.g., GaAs, InP, AlAs, and their alloys) are reviewed. Solar cells made in III-V materials are expensive, but outperform solar cells in every other materials system. The relatively high cost of compound semiconductor wafers necessitates a means to eliminate their use as substrates for epitaial growth of conventional III-V solar cells. There are several approaches to this end, including thin-film solar cells on low-cost, dissimilar substrates such as glass, ceramics, and metal sheets; III-V solar cells epitaxially grown on silicon wafers; film transfer (‘epitaxial lift off’) techniques that allow re-use of the seeding substrate; and assembled arrays of small III-V solar cells on low-cost substrates. Grain boundary effects in polycrystalline III-V films can severely degrade solar cell performance, and impede the application of established thin-film technologies, as developed for amorphous silicon and II-VI semiconductor photovoltaics, to III-V semiconductor-based solar cells. The nearly fifty years of effort in developing thin-film III-V solar cells has underscored the difficulty of achieving large-grain sizes and/or low recombination grain boundaries in polycrystalline films of III-V semiconductors.
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