The Effects of Copper Electroplating Bath on Fabrication of Fine Copper Lines on Polyimide Film Using Semi-additive Method

The copper lines in COF are usually fabricated by subtractive method. As the width of lines are smaller, the subtractive method has a lateral etching problems. In semi-additive method, copper lines are fabricated by lithographic technique followed by electroplating method. Fine line patterns of were used for this study. Two different types of thick photoresist, AZ4620 and PMER900, were employed for PR mold. Copper lines were fabricated by electroplating method. The crack were found in fine copper lines due to high residual stress when normal copper electroplating bath were used. The via filling copper electroplating bath were replaced the normal electroplating bath and then cracks were not found in the fine copper lines. During substrate etching, the lateral etching of copper lines were not occurred.