焊接
材料科学
电阻器
复合材料
可靠性(半导体)
压力(语言学)
倒装芯片
球栅阵列
炸薯条
锡膏
接头(建筑物)
电迁移
作者
Guanqun Zheng,Chunqing Wang
出处
期刊:International Conference on Electronic Packaging Technology
日期:2009-09-29
卷期号:: 1167-1170
被引量:6
标识
DOI:10.1109/icept.2009.5270612
摘要
In order to increase the fatigue life of chip resistor, it is necessary to optimize the shape of solder joints. Shape and fatigue life of chip resistor solder joint were predicted by using finite element analysis methods. Through changing the solder volume, four typical solder joint shape prediction were conducted, and three-dimensional mechanical model of fatigue life analysis was set up. The distribution characteristics of the stress and strain in solder joints under thermal cycle load were analyzed. Based on this, fatigue life of solder joints with different solder volumes was predicted. Analysis results show that under thermal cycling conditions solder joints of tiny concave acquired the best mechanical properties, and the its life is the longest.
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