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Plasma surface modification of polymers for improved adhesion: a critical review

表面改性 材料科学 聚合物 粘附 纳米技术 化学过程 复合材料 机械工程 化学工程 工程类
作者
E. M. Liston,L. Martinů,M. R. Wertheimer
出处
期刊:Journal of Adhesion Science and Technology [Taylor & Francis]
卷期号:7 (10): 1091-1127 被引量:1033
标识
DOI:10.1163/156856193x00600
摘要

Since the earliest systematic research during the 1960s, the field of materials surface modification by 'cold', low-pressure plasma treatment has undergone an enormous expansion. Much of this expansion has taken place in recent years, particularly in the surface modification of polymeric materials, for which there now exist numerous industrial applications (enhancement of paint adhesion, improved bonding in polymer matrix composites, etc.). In this paper, we provide a critical review of the development and trends in this field; reference is also made to other surface modification techniques, particularly to corona treatment, and comparisons are made wherever appropriate. We begin with a brief overview of adhesion theory, and of the physics and chemistry of 'cold' plasmas. Next, interaction mechanisms between a plasma and a polymer surface are examined; these include physical bombardment by energetic particles and by ultraviolet photons, and chemical reactions at or near the surface. The resulting four main effects, namely cleaning, ablation, crosslinking, and surface chemical modification, occur together in a complex synergy, which depends on many parameters controlled by the operator. In spite of this complexity, for there are still many unanswered questions, it is nevertheless possible to optimize the main set of parameters governing a given process, and then to reliably reproduce the process outcome. Three industrially important systems, for which many research results exist, are then separately examined, namely: (i) polymer-polymer bonding, (ii) polymer-matrix composites, and (iii) metal-polymer bonding. Finally, we present a brief overview of commercial plasma reactors for industrial (non-semiconductor) purposes, and of process considerations for efficient use of such equipment. We foresee that the use of plasma processes will continue to expand, because they have unique capabilities, are economically attractive, and are 'friendly' towards the environment.
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