现场可编程门阵列
硅光子学
Stratix公司
硅
计算机科学
光子学
嵌入式系统
材料科学
光电子学
作者
Kaveh Hosseini,Edwin Kok,Sergey Shumarayev,Chia‐Pin Chiu,Arnab Sarkar,Asako Toda,Yanjing Ke,Allen Chan,Daniel Jeong,Mason Zhang,Sangeeta Raman,Thungoc Tran,Kumar Abhishek Singh,Pavan Bhargava,Chong Zhang,Haiwei Lu,Ravi Mahajan,Xiaoqian Li,Nitin Deshpande,Conor O’Keeffe
标识
DOI:10.1364/ofc.2021.th4a.2
摘要
The first 8 Tbps co-packaged FPGA with Silicon-Photonics IO is presented paving the way for co-packaged compute and optical-IO. The Multi-Chip Package integrates Stratix® 10 FPGA with up to five optical IO chiplets.
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