倒装芯片
航空航天
芯片级封装
炸薯条
包装设计
工程类
计算机科学
制造工程
电信
航空航天工程
材料科学
胶粘剂
复合材料
图层(电子)
作者
Liyou Zhao,Zebin Kong,Zhen Li,Kunshu Wang
标识
DOI:10.1109/icept.2017.8046438
摘要
Eight typical flip chip packages were adopted in this study, two domestic, six imported, and five of the six imported were models with experience of aerospace application. The construction and material of these flip chip packages were analyzed, and similarities and differences between the domestic and the imported packages were compared. Construction analysis criteria of flip chip package for aerospace application were summarized based on these results. The results of this study could play an important guiding role in construction analysis of aerospace flip chip package components.
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