Scanning wafer thickness and flatness interferometer

Since the wafer industry is using an increasing amount of double side polished wafers, the future of wafer metrology is very likely to shift from capacitance gauging techniques to optical measurement techniques.Participating in an international project the Technical University of Eindhoven is developing a self calibrating, traceable double side wafer flatness and thickness measurement device.By using proper measurement principles and advanced software a robust and traceable wafer thickness and flatness measurement instrument is created which combines high lateral resolution, nanometer accuracy, high speed and low cost.