Residual stress dynamic detection and vibration characteristics of wire saw busbar

Diamond wire saw cutting is the primary method for processing single crystal silicon carbide (SiC) and silicon (Si) in the photovoltaic and semiconductor industries, the diamond wire saw is formed by busbar electroplate diamond particles, and the diamond wire saw busbar is drawn from steel wires, and the residual stress generated during the drawing process is a critical factor to determine whether the busbar is easy to break. This paper proposes a method to assess residual stress by measuring the free vibration frequency of the busbar, which detects residual stress of busbars with extremely fine and ultra-long (lengths of up to 250 km and diameters as small as 0.04 mm) for real-time, accurate, non-destructive way. First, the residual stress distribution of the drawn busbar is obtained by Abaqus simulation, according to the simulation results, this paper analyzes the mechanical mechanism underlying different types of free bending in the busbar, and develops the relationship between the free bending circle diameter and the residual stresses; Then, the residual stresses are equated with the axial tensile stresses of the busbar by numerical methods, the equivalent mathematical model of the stresses is developed, and the correctness of the model is verified by experiment. Finally, the dynamic model of the moving busbar with residual stresses is established, the effects of different tensions and velocity on the free vibration characteristics of the busbar under residual stresses are analyzed, and the correctness of the detection method is verified by numerical calculations and experimental comparisons. The results show that the residual stress of busbar drawing can be equivalent to tensile force numerically, and the larger the residual stress, the smaller the circle diameter of the busbar, and the larger the first-order natural frequency of free vibration.