Copper Electrodeposition for Advanced Packaging and Hybrid Bonding

This chapter will review copper electrodeposition for semiconductor interconnects with special emphasis on hybrid bonding applications. The motivation for the use of copper for damascene and advanced packaging applications, including hybrid bonding interconnects, will be reviewed, followed by a detailed review of copper electrodeposition fundamentals. The various components of the electrodeposition plating technology, including plating chemicals, reactor, fluidics handling, and dosing system, are discussed. Finally, the critical film properties of a copper-plated film are reviewed in the context of a hybrid bonding interconnect.