Research progress of interfacial adhesion force of copper plating on Ajinomoto build-up films for chip substrates

Ajinomoto build-up film, a polymer composite composed of epoxy resin and silicon dioxide, exhibits significant value in the microelectronics industry due to its low dielectric constant, low dielectric loss, low processing temperature, and excellent resin flowability. It has emerged as a cutting-edge and hot research topic in chip packaging substrates. This article provides an overview of the research progress on copper plating on the surface of Ajinomoto build-up films, primarily discussing the curing reaction mechanism, fundamental properties, and fabrication methods of the build-up film; elucidating the interface adhesion mechanism between the polymer film and copper plating, and exploring methods to enhance the interface adhesion strength of the Ajinomoto build-up film. Finally, the article summarizes the current challenges and limitations in copper plating on Ajinomoto build-up film, and highlights future directions of research and development.