Multi‐Stimuli‐Responsive Dielectric Composites: Composition–Structure–Nanoscale Mechanism–Function Framework for Dynamic Dielectric Engineering

多物理 电介质 材料科学 纳米尺度 工程物理 纳米技术 介电响应 机械工程 电荷(物理) 计算机科学 电子工程 纳米- 桥(图论) 材料设计 介电弹性体
作者
Xianhua Huan,Siheng Liu,Enyuan Zhou,Jiachen Sun,Qianpeng Zhang,Xiaoliang Mo,Lixin Li,Yuchen Mei,Hefeng Li,Chunyang Xu,Bin Du,Yushun Zhao,Jiabao Zhu,Xiaolong Jia,Wei Lü,Hualiang Lv
出处
期刊:Advanced Functional Materials [Wiley]
卷期号:36 (22) 被引量:10
标识
DOI:10.1002/adfm.202521845
摘要

Abstract Dielectric materials are crucial in various fields, including catalysis, energy storage, flexible electronics, and biosensing, and have consequently attracted sustained research interest. Recent reviews have summarized advances in dielectric materials, emphasizing synthesis strategies and applications in specific fields. In practical operations, dielectric materials are often subjected to external physical stimuli such as temperature gradients, electric fields, and mechanical stresses, which drive coupled processes involving polarization, charge transport, and structural reconfiguration. These processes, typically occurring at the nano or atomic scale, decisively influence device performance and reliability. However, reviews on the dynamic dielectric properties of multi‐stimuli‐responsive composites are scarce, particularly from a nanoscale composition–structure–mechanism–function perspective. To bridge this gap, this review outlines the intrinsic properties of representative dielectric constituents and multidimensional design strategies. In addition, it provides a nanoscale analysis of the dynamic response mechanisms induced by external stimuli and their impact on performance, highlighting key challenges such as dielectric reversibility, long‐term stability, and controlled tuning under multiphysics conditions. The review concludes by emphasizing the opportunities for the use of dielectrics in artificial‐intelligence‐driven material discovery, predictive modeling, and multiphysics integration to guide the design of next‐generation responsive dielectric materials for adaptive devices.
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