Overcoming Downscaling Limitations in Organic Semiconductors: Strategies and Progress

Abstract Organic semiconductors have great potential to revolutionize electronics by enabling flexible and eco‐friendly manufacturing of electronic devices on plastic film substrates. Recent research and development led to the creation of printed displays, radio‐frequency identification tags, smart labels, and sensors based on organic electronics. Over the last 3 decades, significant progress has been made in realizing electronic devices with unprecedented features, such as wearable sensors, disposable electronics, and foldable displays, through the exploitation of desirable characteristics in organic electronics. Neverthless, the down‐scalability of organic electronic devices remains a crucial consideration. To address this, efforts are extensively explored. It is of utmost importance to further develop these alternative patterning methods to overcome the downscaling challenge. This review comprehensively discusses the efforts and strategies aimed at overcoming the limitations of downscaling in organic semiconductors, with a particular focus on four main areas: 1) lithography‐compatible organic semiconductors, 2) fine patterning of printing methods, 3) organic material deposition on pre‐fabricated devices, and 4) vertical‐channeled organic electronics. By discussing these areas, the full potential of organic semiconductors can be unlocked, and the field of flexible and sustainable electronics can be advanced.