3D Printing of Interdigitated Finger Capacitors Using Ultra-Precise Deposition Technology

This paper presents the first interdigitated finger capacitors fabricated using the ultra-precise deposition (UPD) printing system by XTPL to the best of our knowledge. Various lengths of the individual fingers are designed, fabricated and compared. The small structural sizes that can be achieved using the UPD technology allow a reduction of parasitic effects resulting in an increase of the self resonant frequency (SRF) and high bandwidths. In addition different dielectric materials are added on top of the printed structures to increase the capacitance. All capacitors are printed on a fused silica substrate, that is prepared accordingly to enable a smooth transition between a coplanar waveguide (CPW) feed and the printed paths. This paper demonstrates the potential of the UPD printing system for printing passive circuit components, particularly interdigitated finger capacitors.