惠斯通大桥
硅
材料科学
振膜(声学)
单晶硅
压阻效应
压力传感器
微电子机械系统
蚀刻(微加工)
制作
灵敏度(控制系统)
硅带隙温度传感器
光电子学
电压
电子工程
声学
电气工程
纳米技术
工程类
振动
机械工程
电阻器
跌落电压
替代医学
图层(电子)
病理
物理
医学
分压器
作者
R. P. Singh,Low Lee Ngo,Ho Soon Seng,F.N.C. Mok
标识
DOI:10.1109/delta.2002.994611
摘要
The paper describes the design, simulation and fabrication of a silicon pressure sensor. The device makes use a of monocrystalline silicon square diaphragm supported by a thick silicon rim. The diaphragm is fabricated by etching away the bulk silicon on a defined region until the required thickness is achieved. The sensor makes use of four piezoresistors diffused into the surface of a diaphragm close to the edges. The piezoresistors are arranged in the Wheatstone bridge configuration to achieve higher voltage sensitivity and low temperature sensitivity. The sensor has been designed and simulated using COVENTER and ANSYS software tools. The paper also discuss the results obtained from the simulations and the response from the fabricated sensor.
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