放大器
晶体管
电气工程
高电子迁移率晶体管
功率(物理)
拓扑(电路)
电压
功率密度
光电子学
材料科学
计算机科学
物理
电子工程
工程类
CMOS芯片
量子力学
作者
Weibo Wang,Fangjin Guo,Tangsheng Chen,Keping Wang
标识
DOI:10.1109/isscc19947.2020.9063161
摘要
W-band power amplifiers (PAs) play an important role in Gb/s-data-rate wireless communication, imaging, and radar applications. Traditionally, multiple transistors are connected in parallel to maximize the output power. Though the active area, including gate width and number of fingers, can be scaled up to generate large transistors, the metallic inter-connection is not suitable for scaling due to random shape and magnetic coupling. Thus, an accurate device model should be investigated by separating the scalable and the non-scalable parts. In additional, the maximum output power of the PA is known to be limited by intrinsic characteristics of power transistor, such as maximum current density, breakdown voltage, and parasitic element. Compared to silicon-based technology, GaN PAs are able to operate at higher voltages and frequencies, thereby reducing loss and improving power density (W/mm 2 ) [1].
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