Effects of Resin/Filler Adhesion on the Thermal and Electrical Conductivity of Polyimide Nanocomposites

With an aim to develop a good coil winding insulation film, fillers of boehmite alumina in the shape of a roughly rectangular plate were added with ratios of 10 and 20 wt% to polyimide. The filler surface was untreated or treated with a methacrylic or an epoxy silane coupling agent. Such prepared polyimide nanocomposites were subjected to various tests to measure the tensile strength, elastic modulus, complex permittivity, and thermal conductivity. It was found that samples with fillers treated using the methacrylic silane coupling agent have the strongest adhesion at the filler/polyimide interfaces and the lowest dielectric loss factor at high temperatures. A positive relationship between the filler/polyimide adhesion and the thermal conductivity is also indicated. These findings are significant since they indicate that the adhesion status at the filler/polymer interface exerts a strong influence on the thermal and electrical conduction processes in the polymer.