材料科学
基面
位错
碳化硅
薄脆饼
GSM演进的增强数据速率
同步加速器
表征(材料科学)
平面(几何)
硅
复合材料
结晶学
光学
光电子学
纳米技术
几何学
电信
化学
物理
计算机科学
数学
作者
Michael Dudley,Ning Zhang,Yu Zhang,Balaji Raghothamachar,Sha Yan Byrapa,Gloria Choi,Edward Sanchez,Darren Hansen,Roman Drachev,Mark J. Loboda
标识
DOI:10.4028/www.scientific.net/msf.645-648.291
摘要
Synchrotron White Beam X-ray Topography (SWBXT) studies are presented of basal plane dislocation (BPD) configurations and behavior in a new generation of 100mm diameter, 4H-SiC wafers with extremely low BPD densities (3-4 x 102 cm-2). The conversion of non-screw oriented, glissile BPDs into sessile threading edge dislocations (TEDs) is observed to provide pinning points for the operation of single ended Frank-Read sources. In some regions, once converted TEDs are observed to re-convert back into BPDs in a repetitive process which provides multiple BPD pinning points.
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