材料科学
焦耳加热
形状记忆聚合物
复合材料
渗流阈值
渗透(认知心理学)
聚合物
变形(气象学)
电阻率和电导率
填料(材料)
纳米-
碳纤维
电气工程
复合数
工程类
神经科学
生物
作者
Jianping Gu,Shenglin Zhao,Hao Duan,Mengqi Wan,Huiyu Sun
标识
DOI:10.1177/1045389x211064336
摘要
Generally, adding the electroconductive fillers into the polymer matrix is a popular approach to endow the shape memory polymers (SMPs) with electroconductivity. Therefore, the shape memory effects (SMEs) of thermally induced SMPs can also be triggered by the electrical current. In essence, both the thermally activated and electrically activated SMEs share the same driving mechanism without considering the effect of heat conduction. In the paper, the constitutive model for the thermally induced SMPs filled with nano-carbon powder is briefly introduced. Then, a modified model is developed to characterize the effects of filler, deformation, and moisture on the electrical conductivity for the first time. After developing the correlation of electric field with Joule heat, the simulation is executed to display the free recovery of the shape memory polymer composites (SMPCs) with different filler content. It is found that the recovery ratio decreases with the increase of carbon powders for the SMPCs with filler content above the percolation threshold. Besides, a good recovery ratio can also be achieved through the application of a lower voltage.
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