倒装芯片
材料科学
散热膏
热接触
热导率
热接触电导
热的
传热
传热系数
复合材料
热传导
对流换热
热力学
热阻
机械
图层(电子)
物理
胶粘剂
作者
Chen Wang,Qiyin Lin,Zongkun Pan,Jun Hong,Yicong Zhou
出处
期刊:Applied Energy
[Elsevier]
日期:2024-02-01
卷期号:356: 122453-122453
被引量:1
标识
DOI:10.1016/j.apenergy.2023.122453
摘要
Flip-chip packaging technology is widely used in the field of electronic packaging. The thermal contact resistances (TCRs) of its double-layer thermal interface materials (TIMs) impact its thermal characteristics. In this paper, a flip-chip package thermal contact model is first constructed considering the internal rough contact interface of double-layer TIMs. Secondly, the effects of friction coefficient, pressure, elastic modulus of double-layer TIMs, thermal conductivity of double-layer TIMs, interstitial medium, and convective heat transfer coefficient on the flip chip package's contact mechanics and thermal properties are analyzed. Finally, the influence of secondary thermal effects on contact mechanics and thermal properties is investigated. The results show that the friction coefficient, pressure, and elastic modulus of double-layer TIMs have a significant influence on the TCRs by changing the actual contact area, but the impact on the heat dissipation of the chip is limited, and the maximum temperature reduction does not exceed 10 K. However, the interstitial medium, convective heat transfer coefficient, and thermal conductivity of double-layer TIMs greatly influence the heat dissipation of the chip and maximum temperature by directly affecting heat transfer performance. Furthermore, secondary thermal effects have varying degrees of influence on contact stiffness, TCRs, and temperature distribution.
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