Introducing abrasive wear into undeformed chip thickness modeling with improved grain kinematics in belt grinding

材料科学 磨料 研磨 炸薯条 碎屑形成 表面粗糙度 复合材料 螺旋(铁路) 运动学 表面光洁度 粒度 刀具磨损 冶金 机械工程 机械加工 计算机科学 经典力学 电信 物理 工程类
作者
Heng Li,Zhonghong Lai,Wenxi Wang,Hao Nan Li
出处
期刊:Journal of Manufacturing Processes [Elsevier BV]
卷期号:108: 903-915 被引量:2
标识
DOI:10.1016/j.jmapro.2023.11.039
摘要

The undeformed chip thickness (UCT) is an essential indicator in understanding the belt grinding mechanism, especially in relation to surface roughness. However, abrasive wear has not been involved in the above modeling studies, even though it always influences the grinding process. In this paper, the evolving grain height distribution, which is governed by the accumulative active grain group, is first quantified using a gamma distribution. Then, based on the geometric analysis of the compliant contact area, improved grain kinematics considering non-uniform grain height is proposed. Finally, based on the above findings, an improved undeformed chip thickness model is established and experimentally validated. The calculated results based on the model show that undeformed chip thickness value approximately obeys a normal distribution at various wear stages unlike a Rayleigh distribution in rigid wheel grinding. The mean and variance of the distribution generally decrease with increasing grinding time, which is supported by the transformation from spiral chips to fragmented chips. Surface prediction is performed to help experimentally verify the reliability of the proposed model, where results illustrate that the predicted and measured roughness exhibits a similar decreasing trend with increasing active grain percentage and grinding time.

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