化学气相沉积
原子层沉积
薄膜
材料科学
背景(考古学)
纳米技术
物理气相沉积
工程物理
原子层外延
图层(电子)
沉积(地质)
燃烧化学气相沉积
光电子学
工艺工程
碳膜
工程类
沉积物
生物
古生物学
作者
Xia Yang,Peijun Ding,Jinrong Zhao,Bin Yin,Xiaoping Shi
标识
DOI:10.1007/978-981-99-2836-1_67
摘要
Film growth equipment is one of the critical aspects in the manufacturing process of integrated circuits. It directly affects the properties of thin film materials such as consistency and dimensional accuracy. This section describes the basic principles of film growth and equipment techniques, including physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), epitaxy system, and spin coater. The context presents a comprehensive and in-depth introduction of the various subtechnology of mainstream principles and an overview of the film growth equipment system as well.
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