Benzocyclobutene-Based Polymers for Microelectronic Applications

Benzocyclobutene polymerization chemistry is unique and attractive in microelectronics because the thermally activated BCB ring-opening reaction does not produce any volatiles such as water, and products from BCB reactions are nonpolar hydrocarbon moieties. The excellent film-forming properties of divinyltetramethylsiloxane bisbenzocyclobutene (DVS-bisBCB) oligomer solutions and the outstanding electrical, thermal, and planarization properties of the cured final product make these polymers the dielectric materials of choice in a variety of microelectronic applications. The ductility of DVS-bisBCB-based polymer is enhanced with the incorporation of an elastomer in the resin matrix. This paper discusses the chemistry of polymers based on DVS-bisBCB and recent advances in product development.