计算机科学                        
                
                                
                        
                            吞吐量                        
                
                                
                        
                            飞秒                        
                
                                
                        
                            算法                        
                
                                
                        
                            遗传算法                        
                
                                
                        
                            机器学习                        
                
                                
                        
                            功率(物理)                        
                
                                
                        
                            人工智能                        
                
                                
                        
                            激光器                        
                
                                
                        
                            激光打孔                        
                
                                
                        
                            过程(计算)                        
                
                                
                        
                            钻探                        
                
                                
                        
                            机械工程                        
                
                                
                        
                            光学                        
                
                                
                        
                            工程类                        
                
                                
                        
                            物理                        
                
                                
                        
                            操作系统                        
                
                                
                        
                            电信                        
                
                                
                        
                            量子力学                        
                
                                
                        
                            无线                        
                
                        
                    
            作者
            
                Zhen Zhang,Shangyu Liu,Yuqiang Zhang,Chenchong Wang,Shiyu Zhang,Zenan Yang,Wei Xu            
         
                    
        
    
            
            标识
            
                                    DOI:10.1016/j.optlastec.2021.107688
                                    
                                
                                 
         
        
                
            摘要
            
            The geometric quality (taper), recast layer, and processing efficiency of micro-holes are important issues in femtosecond laser trepan drilling (LTD). Although one-step drilling based on low-power femtosecond LTD may be an ideal drilling method, its disadvantages such as processing time and taper quality still need to be improved. To address these issues, machine learning was successfully applied to establish an accurate predictive model for the femtosecond LTD process. Based on the machine learning model, the femtosecond LTD results for a given parameter set were quickly and accurately obtained, avoiding a large number of complex experiments and characterization requirements. Subsequently, through the combination of our established optimal machine learning predictive model and a high-throughput genetic algorithm, optimized solutions were quickly and successfully designed for a wide range of process spaces. Finally, the reliability of the optimized process was verified by experiments. The combination of machine learning and a high-throughput optimization algorithm provided an efficient and low-cost solution for the optimization of complex laser processing technology.
         
            
 
                 
                
                    
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