Nucleation of copper on mild steel in copper chloride (CuCl2·2H2O)–1-ethyl-3-methylimidazolium chloride [EMIM]Cl–ethylene glycol (EG) ionic liquid

A dense and adhesive Cu layer was successfully electrodeposited on mild steel in a copper chloride \n(CuCl2�2H2O)–1-ethyl-3-methylimidazolium chloride [EMIM]Cl–ethylene glycol [EG] ionic liquid. The mechanism \nof copper nucleation is studied using cyclic voltammetry and chronoamperometry. It is observed that \n3D-instantaneous nucleation leads to a bright nano-structured deposit. The morphology of the deposit was \ncharacterized SEM and X-ray diffraction techniques. The deposition method was found to take place in an \nenvironmentally friendly green electrolyte without co-ligands such as cyanide and volatile toxic solvents