Effects of mobile charges on interface thermal stresses in a piezoelectric semiconductor composite rod

The interface thermal stresses in the extensional deformation of a composite rod of piezoelectric dielectric and nonpiezoelectric semiconductor layers have been detailed in the present study. A one-dimensional model for extension is used. Analytical expressions of distributed shear stresses along the interface and concentrated shear forces at the ends of the rod are obtained. The distributed shear stress relies on semiconduction and disappears when there are no mobile charges. The concentrated end force is independent of semiconduction. The resultant of the distributed shear stress is comparable to the concentrated end force and therefore is significant. The effects of various geometric and physical parameters are examined.