Adaptative two-phase thermal circulation system for complex-shaped electronic device cooling

Thermal management using a vapor-liquid two-phase circulation system is challenging in compact and complex-shaped electronic devices. In this study, we design and fabricate a heat pipe that can adapt to various shapes, regardless of space constraints. The heat pipe is capable of bending or twisting in three dimensions, making it suitable for electronic devices of arbitrary shapes. It effectively transfers heat from in-plane chips to out-of-plane spaces through flexible circulation pathways. This two-phase heat cycle system achieves an ultra-high thermal conductivity of up to 11,363 W/m·K. The flexible and adaptive design strategy enables efficient heat transfer in complex and compact environments. Thermal management in compact electrical devices is challenging due to limited space and complex geometries. Here, the authors present a flexible heat pipe that conforms to arbitrary shapes without space constraints, achieving an ultra-high thermal conductivity of 11,363 W/m·K.