散热片
鳍
结温
优化设计
计算机科学
功率密度
遗传算法
粒子群优化
功率(物理)
趋同(经济学)
热的
算法
机械工程
数学优化
工程类
数学
物理
热力学
机器学习
经济
经济增长
作者
Linke Zhou,Mohamed Mokhtar Hefny,Yuhang Yang,D.Y. Wang,Samantha Jones-Jackson,Giorgio Pietrini,Ali Emadi
标识
DOI:10.1109/itec55900.2023.10187031
摘要
Thermal management has always been one of the leading technical challenges in high-power power modules. Especially in the current trend of seeking high power density of devices, optimized thermal design is crucial. This paper presents an optimal design method for pin-fin heatsinks for SiC power modules, based on analytical thermal models and Teaching Learning Based Optimization (TLBO) algorithm. First, the analytical thermal model of the pin-fin heatsink is introduced, which combines the Fourier-based conduction model and the empirical convection model. Junction temperature $(T_{j})$ can be directly estimated using this comprehensive model and has been verified to be within a 5% error by numerical simulations. Then, this paper investigates the effectiveness of TLBO in finding the optimal pin-fin heatsink with a compatible cold plate. Compared to Genetic Algorithm (GA) and Particle Swam Optimization algorithm (PSO), TLBO can converge more easily, taking only one-third of the convergence time with the same optimization target and constraint. This proposed optimal design methodology not only improves the power density of the converter system but also provides a valuable design method for researchers and engineers in the field.
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