Novel multi-layer nanoimprint lithography material system enabling nano-patterning of functional optical layers

The use of imprint resists in the frame of a multi-layer systems is a viable and also very effective approach to overcome critical challenges typically associated with the patterning and fabrication of demanding nano-patterned substrates like high-aspect ratio structures often applied e.g. in optical devices. The high etch performance of the systems needed for such pattern transfers is either realized by the fabrication of in situ etch masks or by the preparation of a metal hard mask after the imprint and subsequent etch processes. While it might seem counterintuitive at first glance, to split the different features and functions of one resist into different materials and layers, the overall fabrication process however becomes more inherent robust and is moreover also easier adaptable to changes and modifications like e.g. the use of other substrate materials). Herein, we present in detail different types of multi-layer material systems that are all realized by applying candidates of the mr-NIL210 resist series.